The MSD300 series thermal silicone pads are highly efficient heat dissipation products manufactured by vulcanizing methyl vinyl polysiloxane—a raw material—with specific thermal conductive fillers at high temperatures to form solid sheets. These pads are inserted into the air gaps between heat-generating components and heat sinks or metal enclosures. Their flexibility and elasticity allow them to conform to highly uneven surfaces, enabling heat to be conducted from individual components or the entire PCB to the metal housing or heat sink. This enhances the efficiency and service life of heat-generating electronic components. With a wide range of adjustable thicknesses, they are ideal for filling cavities. Both sides are adhesive, offering excellent workability and ease of maintenance.
Under actual interface conditions, at least 80% of the space is occupied by gas, which has a thermal conductivity of 0.024 W/m·K. Therefore, an interface material with high thermal conductivity is needed to fill the gaps in the interface, accelerate heat transfer, reduce the device temperature, and ensure its normal operation!
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型号/品名 |
颜色 |
厚度（mm） |
硬度（ShoreC） |
密度（g/cm³） |
导热系数（W/m.k） |
耐电压（KV/mm） |
阻燃性 |
热空气老化 |
推荐使用温度(℃) |
禁用物 |
备注 |
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|
VISUAL |
ASTM D374 |
ASTM D729 |
ASTM D2240 |
ASTM D5470 |
ASTM D149 |
UL94 |
SAEJ-1960 |
SAEJ-2236 |
|
可提供卷材、片材及背胶裁切加工。 特殊宽度与厚度可定制，颜色可按要求调整 特殊的导热系数及性能要求可定制。 |
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MSD 300-150 |
灰色 |
0.4~15 |
15~50 |
2.1 |
≥1.5 |
≥4 |
V0 |
无衰减 |
-40~150 |
ROHS HF REACH ELV 符合 |
|
|
MSD 300-200B |
矽胶布+粉红色 |
1-10 |
10-55 |
2.3 |
≥2 |
≥4 |
V0 |
无衰减 |
-40~150 |
ROHS HF REACH ELV 符合 |
|
|
MSD 300-300P |
PI+蓝色 |
0.25~0.4 |
70±10 |
3.1 |
≥3 |
≥10 |
V0 |
无衰减 |
-40~250 |
ROHS HF REACH ELV 符合 |
|
|
MSD 300-300 |
蓝色 |
0.4~15 |
15-55 |
3.1 |
≥3 |
≥4 |
V0 |
无衰减 |
-40~150 |
ROHS HF REACH ELV 符合 |
|
|
MSD 300-500 |
粉红色 灰色 |
0.5~10 |
25~55 |
3.3 |
≥5 |
≥4 |
V0 |
无衰减 |
-40~150 |
ROHS HF REACH ELV 符合 |
|
|
MSD 300-800 |
蓝色 灰色 |
0.5~5 |
25~55 |
3.4 |
≥8 |
≥4 |
V0 |
无衰减 |
-40~150 |
ROHS HF REACH ELV 符合 |
